Ion beam trimmer
The object of the tender is 200 mm wafer particle beam trimming tool for VTT Micronova cleanroom semiconductor front end processing. The particle beam may be an ion beam, or a gas cluster beam, with a full width at half maximum within 3-15 mm. The tool must be compatible with installation in an ISO 4 classified cleanro...
Angebotsfrist:09. Mai 2026
Typ:Ausschreibung
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The object of the tender is 200 mm wafer particle beam trimming tool for VTT Micronova cleanroom semiconductor front end processing. The particle beam may be an ion beam, or a gas cluster beam, with a full width at half maximum within 3-15 mm. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of...
- Ausschreibungstyp: Ausschreibung
- Auftraggeber: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Veröffentlicht: 27. April 2026
- Frist: 09. Mai 2026
Ausschreibungsbeschreibung
The object of the tender is 200 mm wafer particle beam trimming tool for VTT Micronova cleanroom semiconductor front end processing. The particle beam may be an ion beam, or a gas cluster beam, with a full width at half maximum within 3-15 mm. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
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Dokumente und Anhänge
49 Dateien erfasst- PDF Notice (BUL)
- PDF Notice (SPA)
- PDF Notice (CES)
- PDF Notice (DAN)
- PDF Notice (DEU)
- PDF Notice (EST)
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