Wafer metrology
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, ch...
Angebotsfrist:29. Mai 2026
Typ:Ausschreibung
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The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafe...
- Ausschreibungstyp: Ausschreibung
- Auftraggeber: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Veröffentlicht: 27. April 2026
- Frist: 29. Mai 2026
Ausschreibungsbeschreibung
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
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Dokumente und Anhänge
49 Dateien erfasst- PDF Notice (BUL)
- PDF Notice (SPA)
- PDF Notice (CES)
- PDF Notice (DAN)
- PDF Notice (DEU)
- PDF Notice (EST)
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