The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
Angebotsfrist:26. März 2026(abgelaufen)
Typ:Ausschreibung
Nächster Schritt
Erhalten Sie alle Dokumente zu "Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding" von Silicon Austria Labs GmbH und behalten Sie Fristen und Einreichungshinweise im Blick.
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The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
Nach Registrierung stehen Unterlagen, Fristen und Hinweise zur Einreichung strukturiert bereit.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a single wafer ashing tool for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a single wafer wet clean tool for Silicon Austria Labs GmbH.
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