The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
Angebotsfrist:16. Januar 2026(abgelaufen)
Typ:Ausschreibung
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Erhalten Sie alle Dokumente zu "Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging" von Silicon Austria Labs GmbH und behalten Sie Fristen und Einreichungshinweise im Blick.
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The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
Nach Registrierung stehen Unterlagen, Fristen und Hinweise zur Einreichung strukturiert bereit.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services such as trainings of a frame / wafer cleaning unit for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a resist processing system for Silicon Austria Labs GmbH.
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