The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a manual or semi-automated wafer reflow vacuum oven as well as services such as trainings for Silicon Austria Labs GmbH.
Angebotsfrist:30. September 2025(abgelaufen)
Typ:Ausschreibung
Nächster Schritt
Erhalten Sie alle Dokumente zu "Silicon Austria Labs – Chips JU: Wafer Reflow Vacuum oven (manual or semi-automated)" von Silicon Austria Labs GmbH und behalten Sie Fristen und Einreichungshinweise im Blick.
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The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a manual or semi-automated wafer reflow vacuum oven as well as services such as trainings for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a manual or semi-automated wafer reflow vacuum oven as well as services such as trainings for Silicon Austria Labs GmbH.
Nach Registrierung stehen Unterlagen, Fristen und Hinweise zur Einreichung strukturiert bereit.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping and reflow tool as well as services such as trainings for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping and reflow tool as well as services such as trainings for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.
In weniger als 60 Sekunden erhalten Sie Vollzugang für Silicon Austria Labs – Chips JU: Wafer Reflow Vacuum oven (manual or semi-automated).
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