LPCVD Cluster (TEOS/nitride/poly/oxidation) (IPMS-MRS06.1) - PR1121717-2480-P
1 Stück - LPCVD Cluster Optionen: Option 1 - LV Pos. 2.3 - Wafer thickness for thick wafers Option 2 - LV Pos. 13.3 - The tool is covered by an extended warranty. Please provide information what is covered within this extended warranty (e.g. support, repair and part cost).
Angebotsfrist:10. April 2026(abgelaufen)
Typ:Ausschreibung
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Inhalt auf einen Blick
1 Stück - LPCVD Cluster Optionen: Option 1 - LV Pos. 2.3 - Wafer thickness for thick wafers Option 2 - LV Pos. 13.3 - The tool is covered by an extended warranty. Please provide information what is covered within this extended warranty (e.g. support, repair and part cost).
- Ausschreibungstyp: Ausschreibung
- Auftraggeber: Fraunhofer-Gesellschaft - Einkauf B12
- Veröffentlicht: 09. März 2026
- Frist: 10. April 2026
- Thema: Verfahrenstechnik
Ausschreibungsbeschreibung
1 Stück - LPCVD Cluster Optionen: Option 1 - LV Pos. 2.3 - Wafer thickness for thick wafers Option 2 - LV Pos. 13.3 - The tool is covered by an extended warranty. Please provide information what is covered within this extended warranty (e.g. support, repair and part cost).
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Dokumente und Anhänge
49 Dateien erfasst- PDF Notice (BUL)
- PDF Notice (SPA)
- PDF Notice (CES)
- PDF Notice (DAN)
- PDF Notice (DEU)
- PDF Notice (EST)
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- Die Angebotsfrist endet am 10. April 2026.
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- Der Auftraggeber ist Fraunhofer-Gesellschaft - Einkauf B12.
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